The Electronic Packaging Interconnect Technology Symposium, (EPITS 2019)

In the extensive technology era, the industry was pushing the limits in both design and manufacturing areas. Small scale microelectronics technologies those in the micro and nano-scale area are the most exciting developments. Researchers working at or near the molecular level have recently made significant breakthroughs that will enable companies to create entirely new products, applications, and highly efficient manufacturing techniques. These applications products required excellent performance that allowed to withstand in harsh environments which is thermal stresses, vibration and shock. Therefore, its has been a great deal of research and innovation concerning robust design and the selection of novel materials. Some of the most spectacular developments in electronics packaging are now beginning to take shape. The Electronic Packaging Interconnect Technology Symposium, (EPITS 2019) is bringing together packaging experts in these critical areas and others to sharing and exchange the ideas in electronics technology. Don’t miss your chance to get up to speed on today’s most important topics in packaging, all in one place on one day. Topics of interest or submission include, but are not limited to;

(1)  Challenges in improving the reliability of Tin (Sn) base Pb-free solder alloys

(2)  Challenges in implementing the Restriction of Hazardous Substances (RoHS)

(3)  Emerging interconnect materials and technologies

(4)  Non-solder interconnect materials at chip and package levels

(5)  Fundamental materials behavior for electronic packaging materials

(6)  Electromigration, thermomigration, stress-migration and mechanical effects

(7)  Advanced characterization methods as applied to electronic packaging technology

(8)  Whisker growth in tin, tin-based alloys and other metallic systems related to electronic packaging materials

(9) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics.

(10) Electronic Packaging Design Technology: IC and Board Level

(11)  IC Fabrication and Assembly

(12) Board Fabrication and Assembly

(13) Thermoelectric, solar cells and thin film technology

(14) Green materials and technology for electronic applications